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2020, Vol. 41(15): 39-43    DOI: 10.13884/j.1003-3807hxjy.2018110114
Investigation on Properties and Influencing Factors of Plating in Electroplating Copper Experiment*
ZHANG Ran, RAN Ming**
College of Chemistry and Materials Science, Sichuan Normal University, Chengdu 610068, China
Received null  Revised null
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